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2x2x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flat, No Lead Package (MD) - 4x4x0.9 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf MSOP, 12 Pin Placed - Wide, 5.3 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 32-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 9x-dip-switch SPST , Slide, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 28-lead though-hole mounted.

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