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5.08mm TO-220F-2, Vertical, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Horizontal RM 2.54mm staggered type-2 TO-220F-9 Vertical RM 1.27mm staggered type-2 TO-220-9, Horizontal, RM 10.9mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-3 Vertical RM 2.54mm TO-220F-3, Vertical, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Horizontal RM 10.95mm SOT-93 TO-218-2, Vertical, RM 3.81mm, see https://www.onsemi.com/pub/Collateral/NJL3281D-D.PDF TO-264-5 Vertical RM 0.9mm staggered type-1 TO-220F-5 Vertical RM 1.7mm Pentawatt Multiwatt-5 TO-220-5, Vertical, RM 1.27mm, Multiwatt-7, staggered type-1 TO-220-4, Horizontal, RM 5.45mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-3 Horizontal RM 2.54mm staggered type-1 TO-220F-11, Vertical, RM 2.54mm, see https://www.diodes.com/assets/Package-Files/TO126.pdf TO-126-3 Horizontal RM 2.54mm TO-220-3, Vertical, RM 1.7mm, Pentawatt, Multiwatt-5, staggered type-2, see http://www.ti.com/lit/ds/symlink/lm3886.pdf TO-220F-11 Vertical RM 2.286mm Plastic near cylindrical package Sod-70 see: https://www.nxp.com/docs/en/data-sheet/KTY81_SER.pdf [StepUp generated footprint] SOT-227 / SOT-227B / ISOTOP, M4 mounting hole 2mm no annular Mounting Hole 5.3mm, M5, DIN965 mounting hole 4.5mm no annular Mounting Hole 3.2mm, M3, ISO14580 mounting hole 5.3mm no annular m4 iso7380 Mounting Hole 3.2mm, no annular, M2 mounting hole 2.7mm no annular Mounting Hole 3.2mm, M3, DIN965 mounting hole 6.4mm m6 din965 Mounting Hole 2mm, no annular m4 Mounting Hole 6.4mm, M6, ISO14580 mounting hole 2.2mm m2 iso14580 Mounting Hole 2.2mm, M2, DIN965 mounting hole 5.3mm no annular m2.5 din965 Mounting Hole 2.5mm, no annular m2.5 Mounting Hole 8.4mm, no annular, M5, ISO7380 mounting hole 4.3mm m4 Mounting Hole 3.2mm, no annular, M3 mounting hole 5.3mm m5 iso14580 Mounting Hole 8.4mm, M8 mounting hole 8.4mm m8 Mounting Hardware, inside through hole 3.3mm, height 11, Wuerth electronics 9774060360 (https://katalog.we-online.de/em/datasheet/9774060360.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0830, 8 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FH41-30S-0.5SH, 30 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 0.75 mm² wires, basic insulation, conductor diameter 1.7mm, outer diameter 2mm, outer diameter 2.3mm, size.

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