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BGA, 20x20 grid, 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Surface mounted pin header SMD 2x03 2.54mm double row surface-mounted straight pin header, 2x03, 1.27mm pitch, double rows Through hole straight socket strip, 2x39, 1.00mm pitch, 2.0mm pin length, double rows Through hole pin header THT 1x02 2.00mm single row Through hole angled pin header, 2x38, 2.00mm pitch, 6.35mm socket length, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip SMD 2x20 1.00mm double row surface-mounted straight pin header, 1x22.

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