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0.35mm SOT-1123 small outline package; 24 leads; body width 4.4 mm (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 transistor TO-92 2-pin leads in-line, narrow, oval pads, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf 24-Lead Plastic Shrink Small Outline (SO) (http://www.everlight.com/file/ProductFile/201407061745083848.pdf 5-Lead Plastic Small Outline (ST)-4.4 mm Body [QFN] with thermal vias (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-9/ Infineon PG-DSO 12 pin, exposed pad: 4.5x8.1mm, with thermal vias; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (perimeter) array, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double rows Through hole straight pin header, 2x37, 2.54mm pitch, 6mm pin length, single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole pin header THT 2x34 2.00mm double row Through hole straight socket strip, 2x07, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x21, 1.00mm pitch, 2.0mm pin length, single row Through hole angled pin header THT 1x12 2.00mm single row Surface mounted socket strip SMD 2x12 1.27mm double row SMD IDC box header, 2x03, 2.54mm pitch, single row Surface mounted pin header THT 1x07 2.00mm single row Surface mounted pin header THT 1x29 2.00mm single row Surface mounted pin header THT 2x22 1.00mm double row surface-mounted straight pin.

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