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Tabs, board locks (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm Highspeed card edge connector for 1.6mm PCB's with 08 contacts (not polarized Highspeed card edge connector for PCB's with 70 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 05 contacts (not polarized Highspeed card edge connector for PCB's with 60 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 05 contacts (not polarized Highspeed card edge connector for PCB's with 20 contacts (not polarized Highspeed card edge connector for PCB's with 40 contacts (not polarized Highspeed card edge connector for 1.6mm PCB's with 50 contacts (not polarized Highspeed card edge connector for 2.4mm PCB's with 50 contacts (polarized Highspeed card edge connector for PCB's with 40 contacts (polarized Highspeed card edge connector for PCB's with 50 contacts (not polarized Highspeed card edge connector for 2.4mm PCB's with 40 contacts (polarized Highspeed card edge connector for 2.4mm PCB's with 60 contacts (polarized Highspeed card edge connector for PCB's with 60 contacts (polarized conn samtec card-edge socket high-speed 0.8 mm BGA-64, 10x10 raster, 9x9mm package, pitch 0.65mm UFBGA-32, 6x6, 4x4mm package, pitch 0.4mm; see section 6.2 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-265, 17x17 raster, 14x14mm package, pitch 0.4mm; http://ww1.microchip.com/downloads/en/devicedoc/atmel-8235-8-bit-avr-microcontroller-attiny20_datasheet.pdf#page=208 WLCSP-16, 1.409x1.409mm, 16 Ball, 4x4 Layout, 0.35mm Pitch, https://www.onsemi.com/pdf/datasheet/ncp163-d.pdf#page=23 6pin Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=42, https://www.ti.com/lit/ml/mxbg018l/mxbg018l.pdf BGA 5 0.5 YZP Texas Instruments, DSBGA, area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline (SS)-5.30 mm Body [QFN] with corner pads and trace routing to de-bodge the pots. Updates the potentiometer pads and trace routing to de-bodge the pots. 6523065365c12ceda76dbda25c5041018c73eb63 's notes on repique/caixa, two or three for surdos c6741b48f0 More random files 7e24b3de83 Notes from MK's PCB livestream # Format documentation: http://kicad-pcb.org/help/file-formats/ # KiCad backups folders *-backups # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) Total plated holes count 16 Latest commits for file Images/capsocket.png b554ec2138 Add footprint.

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