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Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 44 leads; body width 16.90 mm Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 12-lead.

.../PinHeader_1x02_P2.54mm_Vertical.kicad_mod | 35 ..._Dual_Slotted_Mounting_Hole_NPTH.kicad_mod | 35 ..._Dual_Slotted_Mounting_Hole_NPTH.kicad_mod .
SW_NKK_GW12LJPCF SW 0 40 Y N.
/ metric / decimal.
4.001943e+000 2.495526e+001 facet normal 0.977433 -0.186445 0.0993094 facet.

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