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AC Form A (NO), SPST http://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Data+Sheet%7FPCH_series_relay_data_sheet_E%7F1215%7Fpdf%7FEnglish%7FENG_DS_PCH_series_relay_data_sheet_E_1215.pdf Relay socket DPDT Finder 40.41, Pitch 3.5mm/7.5mm, https://www.finder-relais.net/de/finder-relais-serie-40.pdf Relay DPDT Finder 40.31 Pitch 3.5mm Relay DPDT Finder 40.41 Pitch 3.5mm Relay DPDT Finder 40.52, Pitch 5mm/7.5mm, https://www.finder-relais.net/de/finder-relais-serie-40.pdf Relay DPDT Schrack-RT2 RM5mm 16A 250V AC Relay Relay SPST 10mm 24mm, https://www.panasonic-electric-works.com/pew/es/downloads/ds_dw_hl_en.pdf AXICOM IM-Series Relay DPDR Pitch 5.08 AXICOM IM-Series Relay DPDR Pitch 3.2mm AXICOM IM-Series Relays, DPDR, Pitch 5.08 IM Signal Relay DPDT FRT5 narrow footprint Finder 32.21-x000 Relay, DPDT, https://gfinder.findernet.com/public/attachments/30/EN/S30EN.pdf AXICOM IM-Series Relay J JLeg AXICOM HF3-Series Relay Pitch 1.27mm Slug Up (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0 x 15.9mm Pitch 1.27mm Slug Down Thermal Vias (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0x15.9mm Pitch 1.27mm HSOP 11.0x15.9mm Pitch 0.65mm Slug Up (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0 x 15.9mm Pitch 1.27mm SSOP, 8 Pin (http://www.ti.com/lit/ml/mpds382b/mpds382b.pdf), generated with kicad-footprint-generator JST VH series connector, SM16B-SHLS-TF (http://www.jst-mfg.com/product/pdf/eng/eSHL.pdf), generated with kicad-footprint-generator JST ZE series connector, S03B-XASK-1N-BN (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Hirose DF12E SMD, DF12E3.0-50DP-0.5V, 50 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator connector Molex Micro-Fit_3.0 top entry Molex Micro-Fit 3.0 Connector System, 43045-0200 (alternative finishes: 43045-062x), 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole lga land grid array Bosch LGA, 8 Pin (http://www.winbond.com/resource-files/w25q32jv%20revg%2003272018%20plus.pdf (page 68)), generated with kicad-footprint-generator Soldered wire connection, for 5 times 0.75 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Hirose DF13C vertical Hirose DF12C SMD, DF12C3.0-40DS-0.5V, 40 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator.

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