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Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 2x4 (perimeter) array, NSMD pad definition Appendix A Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=297, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole straight socket strip, 1x11, 2.54mm pitch, double rows Through hole vertical IDC box header, 2x30, 1.27mm pitch, single row Through hole straight Samtec HPM power header series 3.81mm post length THT 1x04 2.00mm single row Through hole angled pin header, 2x29, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight Samtec HPM power header series 3.81mm post length THT 1x14 1.27mm single row style2 pin1 right Through hole angled socket strip SMD 1x34 2.54mm single row Through hole socket strip SMD 1x07 2.54mm single row style2 pin1 right Through hole straight pin header, 1x21, 1.00mm pitch, single row Through hole straight pin header, 2x35, 2.54mm pitch, single row Surface mounted socket strip THT 2x34 2.00mm double row Through hole socket strip THT 1x11 1.27mm single row Through hole pin header THT 2x05 2.00mm double row Through hole angled socket strip, 2x24, 1.27mm pitch, 4.4mm socket length, single row style1 pin1 left Surface mounted pin header THT 1x32 2.00mm single row style2 pin1 right Through hole pin header SMD 1x10 2.00mm single row style1 pin1 left Surface mounted socket strip THT 2x06 1.00mm double row surface-mounted straight pin header, 2x33, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip SMD 1x06 2.00mm single row Through hole socket strip THT 2x10 2.54mm double row Through hole pin header THT 1x29 2.00mm single row style1 pin1 left Surface mounted pin header THT 2x25 1.27mm double row Through hole IDC header, 2x10, 1.27mm pitch, single row Through hole socket strip SMD 2x11 2.00mm double row surface-mounted straight pin header, 2x26, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC box header, 2x12, 2.00mm pitch, single row style2 pin1 right Through hole angled pin header SMD 1x38 1.00mm single row style1 pin1 left Surface mounted pin header THT 2x01 2.00mm double row Through hole straight pin header.

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