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BackHttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition Appendix A BGA 484 1 FG484 FGG484 Artix-7 BGA, 16x16 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header SMD 1x22 2.54mm single row Through hole pin header THT 1x06 1.27mm single row style1 pin1 left Surface mounted socket strip THT 2x25 2.54mm double row surface-mounted straight socket strip, 1x25, 2.00mm pitch, double rows Through hole straight pin header, 2x26, 1.00mm pitch, single row Surface mounted pin header THT 2x34 2.54mm double row Through hole IDC header, 2x20, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 2x09 1.00mm double row Through hole angled pin header, 2x28, 1.00mm pitch, double.
- Toslink, TORX170, TORX173, TORX193, TORX194.
- 64800911622 (https://katalog.we-online.com/em/datasheet/6480xx11622.pdf), generated with kicad-footprint-generator Hirose.