Labels Milestones
BackDSBGA, 1.43x1.41mm, 8 bump 3x3 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole straight socket strip, 2x28, 2.00mm pitch, 6.35mm socket length, double rows Through hole horizontal IDC header THT 1x03 1.00mm single row style2 pin1 right Through hole socket strip SMD 1x14 2.00mm single row style2 pin1 right Through hole angled pin header, 2x33, 2.00mm pitch, double rows Surface mounted pin header SMD 2x34 1.27mm double row surface-mounted straight socket strip, 1x12, 2.54mm pitch, 6mm pin length, double rows Through hole IDC box header, 2x10, 1.00mm pitch, 2.0mm pin length, double rows Through hole socket strip THT 1x27 1.00mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole straight Samtec HPM power header series 3.81mm post length, 1x15, 5.08mm pitch, single row style1 pin1 left Surface mounted pin header SMD 1x29 1.27mm single row Through hole pin header THT 1x07 5.08mm single row Through hole angled socket strip, 2x05, 2.00mm pitch, 4.2mm pin length, double rows Surface mounted socket strip SMD 1x11 1.00mm single row style2 pin1 right Through hole straight pin header, 1x35, 2.00mm pitch, 6.35mm socket length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 1x22, 2.54mm pitch, DIN 41651 / IEC.
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