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BackSSOP56: plastic shrink small outline package; 44 leads; body width 16.90 mm Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 18-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 11.43mm 450mil SMDSocket LongPads 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils THT DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket LongPads 4-lead though-hole mounted.
- Description="2x5 pin shrouded header 2.54.
- 15.24mm 0.25W = 1/4W, length*diameter=6.3*2.5mm^2.
- 1x02 2.54mm single row style1 pin1 left Surface.