Labels Milestones
BackClearance8mm SMD DIP DIL PDIP 2.54mm 10.16mm 400mil Socket 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x21.88mm 8x-dip-switch SPST KingTek_DSHP08TJ, Slide, row spacing 22.86 mm (900 mils), LongPads 48-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 12-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 20-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 20-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads THT DIP DIL ZIF 10.16mm 400mil Socket LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf Power Integrations variant of 10-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP 2.54mm 10.16mm 400mil SMDSocket SmallPads 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x26.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile.
New Pull Request