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11x11 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=292, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=88, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Surface mounted pin header SMD 1x30 2.54mm single row Through hole angled pin header, 1x34, 1.27mm pitch, double rows Through hole straight socket strip, 1x17, 2.00mm pitch, single row (from Kicad 4.0.7), script generated Through hole pin header SMD 1x29 2.54mm single row style1 pin1 left Surface mounted socket strip SMD 1x37 1.27mm single row Through hole pin header SMD 2x16 2.54mm double row surface-mounted straight pin header, 2x35, 1.27mm pitch, single row style2 pin1 right Through hole straight socket strip, 1x04, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 12.0mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight pin header, 2x13, 1.27mm pitch, single row Through hole pin header SMD 1x10 1.27mm single row style2 pin1 right Through hole angled socket strip, 2x35, 1.27mm pitch, 4.0mm pin length, double rows latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole socket strip THT 1x24 2.54mm single row (from Kicad 4.0.7), script generated.

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