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InvenSense MEMS I2S ICS-43434 TDK InvenSense MEMS I2S SPH0645LM4H Knowles Sensirion, SHT40, SHT41, SHT45, DFN, 4 Pin (https://www.sensirion.com/fileadmin/user_upload/customers/sensirion/Dokumente/0_Datasheets/Humidity/Sensirion_Humidity_Sensors_SHTC3_Datasheet.pdf Sensirion DFN-8 SHT3x-DIS (https://www.sensirion.com/fileadmin/user_upload/customers/sensirion/Dokumente/2_Humidity_Sensors/Datasheets/Sensirion_Humidity_Sensors_SHT3x_Datasheet_digital.pdf 24-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of TO-92), also known as TO-226, wide, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 20 leads; body width 3 mm; (see NXP sot054_po.pdf TO-92 leads in-line, wide, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot361-1_po.pdf TSSOP, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=289), generated with kicad-footprint-generator Molex LY 20 series connector, DF52-2S-0.8H (https://www.hirose.com/product/en/products/DF52/DF52-3S-0.8H%2821%29/), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/40001839B.pdf#page=464), generated with kicad-footprint-generator Molex Molex 0.30mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0280, 28 Circuits (https://www.molex.com/pdm_docs/sd/2005280280_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-132-02-xxx-DV, 32 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0834-6-81&productname=DF12E(3.0)-50DP-0.5V(81)&series=DF12&documenttype=2DDrawing⟨=en&documentid=0000992393), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0060, 6 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ103130.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 2.5 mm² wires, basic insulation, conductor diameter 0.5mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 1.5 mm² wire, reinforced insulation, conductor diameter 0.48mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py 64-Lead Plastic Thin Quad Flat, No Lead Package - 6x8x0.9mm Body (https://www.microsemi.com/document-portal/doc_download/131677-pd70224-data-sheet Mini Circuits Case style FG (https://ww2.minicircuits.com/case_style/FG873.pdf LQFN, 48 Pin (http://www.ti.com/lit/ds/symlink/cc1312r.pdf#page=48), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP.

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