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Hamamatsu spectrometer, see http://www.hamamatsu.com/resources/pdf/ssd/c12880ma_kacc1226e.pdf 3.2mmx2.7mm, light sensor, i2c interface, 6-pin chipled package, https://docs.broadcom.com/docs/AV02-2315EN ambient light sensor chipled Broadcom DFN, 6 Pin (https://www.jedec.org/sites/default/files/docs/Mo-178c.PDF variant AA), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 56 Pin (JEDEC MO-194 Var AB https://www.jedec.org/document_search?search_api_views_fulltext=MO-194), generated with kicad-footprint-generator JST SUR series connector, 53398-1471 (http://www.molex.com/pdm_docs/sd/533980271_sd.pdf), generated with kicad-footprint-generator Resistor SMD 1812 (4532 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://www.vishay.com/docs/20035/dcrcwe3.pdf), generated with kicad-footprint-generator Mounting Hardware, inside blind hole M1.6, height 6, Wuerth electronics 9775046960 (https://katalog.we-online.com/em/datasheet/9775046960.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, DF11-16DP-2DSA, 8 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-2P-1.25DSA%2850%29/), generated with kicad-footprint-generator JST GH series connector, DF3EA-03P-2H (https://www.hirose.com/product/document?clcode=CL0543-0332-0-51&productname=DF3EA-5P-2H(51)&series=DF3&documenttype=2DDrawing&lang=en&documentid=0001163317), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 6 times 0.75 mm² wires, reinforced insulation, conductor diameter 2.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Hirose DF12E SMD, DF12E3.0-14DP-0.5V, 14 Pins (http://www.molex.com/pdm_docs/sd/559320210_sd.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-4180, 18 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 32-Lead Frame Chip Scale Package LFCSP (5mm x 3mm) (see Linear Technology DFN_24_05-08-1864.pdf DKD Package; 24-Lead Plastic QFN (2mm x 2mm) (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf HTSSOP, 16 Pin (http://cds.linear.com/docs/en/datasheet/37551fd.pdf#page=23), generated with kicad-footprint-generator Mounting Hardware, inside through hole.

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