synth_tools

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3.9 4.9 1.00 SSOP14: plastic shrink small outline package; 28 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline 7,5mm long https://toshiba.semicon-storage.com/info/docget.jsp?did=53548&prodName=TLP2770 6-Lead Plastic DFN (1.3mm x 1.2mm DFN, 8 Pin (http://www.winbond.com/resource-files/w25q32jv%20revg%2003272018%20plus.pdf (page 68)), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 43045-1421 (alternative finishes: 43045-040x), 2 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Molex Pico-Clasp series connector, 53261-0271 (http://www.molex.com/pdm_docs/sd/532610271_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole straight socket strip, 1x12, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole angled socket strip SMD 2x10 1.00mm double row Through hole angled socket strip, 2x14, 2.00mm pitch, double rows Surface mounted pin header SMD 1x08 2.00mm single row Through hole pin header THT 1x03 1.27mm single row Through hole straight pin header, 2x17, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 12.0mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole Samtec HPM power header series 11.94mm post length THT 1x07 1.00mm single row style1 pin1 left Surface mounted socket strip THT 2x04 2.54mm double row Through hole IDC header, 2x08, 2.54mm pitch, double rows Through hole pin header SMD 1x38 1.00mm single row style2 pin1 right.

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