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BackPin (https://www.onsemi.com/pub/Collateral/566DB.PDF), generated with kicad-footprint-generator ipc_noLead_generator.py 72-Lead Frame Chip Scale Package - 9x9 mm Body [HTSSOP], with thermal vias in pads, 5 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0834-6-81&productname=DF12E(3.0)-50DP-0.5V(81)&series=DF12&documenttype=2DDrawing⟨=en&documentid=0000992393), generated with kicad-footprint-generator ipc_gullwing_generator.py PQFP, 208 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator Hirose DF13 through hole, DF63M-2P-3.96DSA, 2 Pins per row.
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