Labels Milestones
BackPin 7 8-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils THT DIP DIL PDIP SMDIP 2.54mm 9.53mm 375mil 4-lead surface-mounted (SMD) DIP package, row spacing 22.86 mm (900 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 10-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 22-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 18-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket THT DIP DIL PDIP 2.54mm 7.62mm 300mil LowProfile 1x-dip-switch SPST Copal_CVS-01xB, Slide, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 18-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), SMDSocket, LongPads 22-lead though-hole mounted DIP package.
- Controls // step rotary.
- Connector, Poke-In series, 1-way, 4.0mm pitch, AWG18-22 (0.3255-0.823mm2.
- Notes C10, C14 is a ceramic 104 power.