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1x09 2.54mm single row Surface mounted pin header SMD 1x04 2.54mm single row style2 pin1 right Through hole angled pin header, 2x22, 1.00mm pitch, double rows Through hole vertical IDC box header, 2x32, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Surface mounted pin header SMD 1x33 2.00mm single row Through hole angled socket strip THT 2x01 2.54mm double row Through hole angled pin header THT 1x24 1.27mm single row style2 pin1 right Through hole pin header THT 1x01 1.27mm single row Through hole angled pin header, 2x36, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 1x05 2.54mm single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x30 1.27mm double row Through hole IDC header, 2x25, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole horizontal IDC header THT 2x23 1.00mm double row surface-mounted straight pin header, 2x30, 1.00mm pitch, single row 0.8 mm BGA-64, 10x10 raster, 4.201x4.663mm package, pitch 0.35mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, YZR pad definition Appendix A BGA 1156 1 RF1157 RF1158 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=294, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=90, NSMD pad definition Appendix A BGA 484 1 FG484 FGG484 Artix-7 BGA, 19x19 grid, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD.

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