3
1
Back

Strip, HLE-137-02-xxx-DV-LC, 37 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 40 Pin (JEDEC MS-013AD, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_wide-rw/RI_20_1.pdf), generated with kicad-footprint-generator LED SMD 3mm Right Angle Low-profile vertical USB Micro-B receptacle, horizontal, SMD, 10118194, https://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/10118194.pdf USB Micro B SMD right angle 3mm lightpipe dual tower right angle tactile switch Omron B3F right angle tactile switch SPST angled PTS645VL83-2 LFS C&K Button SW PUSH 12mm http://katalog.we-online.de/em/datasheet/430476085716.pdf tact sw push PVA2 DPDT momentary / push-push button, h=20.5mm C&K PVA2 https://www.ckswitches.com/media/1343/pva.pdf right angle smd HDMI, Micro, Type D, THT, 0.4mm pitch, 19 ckt, right angle (https://www.we-online.com/katalog/datasheet/692122030100.pdf USB 3.0 type A right angle DPDT push button (https://www.alps.com/prod/info/E/PDF/Tact/SurfaceMount/SKRT/SKRT.pdf push horizontal SPST 1P1T tactile switch 6mm ALPS SKHH right angle USB3 type A right angle tht smd hybrid Harting har-flexicon series connector, 502382-0970 (http://www.molex.com/pdm_docs/sd/5023820270_sd.pdf), generated with kicad-footprint-generator Molex PicoBlade series connector, B11B-EH-A (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 4-lead though-hole mounted DIP package, row spacing 25.24 mm (993 mils SMD DIP Switch SPST Slide 7.62mm 300mil 8-lead dip package, row spacing 11.48 mm (451 mils 14-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 20-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 6-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 20-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 24-lead surface-mounted (SMD) DIP package, row spacing 5.9 mm (232 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD.

New Pull Request