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BackSOT-383FL package, http://www.onsemi.com/pub_link/Collateral/ENA2267-D.PDF SOT-543 4 lead surface package SOT 963 6 pins package 1x0.8mm pitch 0.35mm SOT-1123 small outline package; 24 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf HTSSOP, 38 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_38_05-08-1701.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0280, 28 Circuits (https://www.molex.com/pdm_docs/sd/2005280280_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator JST EH horizontal JST XA series connector, B10P-VH-B (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator JST SUR series connector, B4B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 36 Pin (http://www.ti.com/lit/ds/slvsba5d/slvsba5d.pdf#page=35), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On Type FFC/FPC Connector, For LVDS, 6.05mm Height, Vertical, Surface Mount, http://www.molex.com/pdm_docs/sd/1054440001_sd.pdf.
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