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Thermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments (see http://www.ti.com/lit/ds/symlink/lm5118.pdf HSOIC, 8 Pin (https://www.onsemi.com/pub/Collateral/NB3N551-D.PDF#page=7), generated with kicad-footprint-generator Resistor SMD 0612 (1632 Metric), square (rectangular) end terminal.

• 11675 bytes .../Panels/FIREBALL VCO.png | Bin 0 .
• -0.956957 -0.288281 0.0335834 vertex 5.51437 -1.05741 21.6407 facet.
• 0.871973 0.0993049 facet normal 9.992251e-001 1.998935e-003 3.930955e-002 facet.

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