Labels Milestones
Back(http://www.st.com/resource/en/datasheet/tda7264.pdf TO-220-9 Vertical 2.54mm Pitch (http://www.st.com/resource/en/datasheet/tda7264.pdf TO-220-9 Vertical 2.54mm Pitch (http://www.st.com/resource/en/datasheet/tda7264.pdf TO-220-9 Vertical RM 2.54mm TO-220F-4, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 5.08mm 7.62mm 300mil reed relay series, see https://standexelectronics.com/wp-content/uploads/datasheet_reed_relay_DIP.pdf DIL DIP PDIP 2.54mm 15.24mm 600mil SMDSocket SmallPads 64-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils.
- Height 4.5, Wuerth electronics 9774025360 (https://katalog.we-online.de/em/datasheet/9774025360.pdf), generated.
- Lattice caBGA-756, ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32.