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6.5x15mm^2 drill 1.2mm pad 3mm single screw terminal block RND 205-00078 pitch 10mm size 95x10.3mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00048 pitch 5mm size 51.5x15mm^2 drill 1.2mm pad 2mm PhoenixContact PTSM0,5 8 HV 2,5mm vertical SMD spring clamp terminal block RND 205-00019, 9 pins, pitch 3.5mm, size 39.5x8.3mm^2, drill diamater 1.3mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00276_DB_EN.pdf, script-generated with , script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block WAGO 236-312 45Degree pitch 10mm size 105x10.3mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00242, 3 pins, pitch 3.5mm, size 17.5x6.5mm^2, drill diamater 1.1mm, pad diameter 2.2mm, see http://www.mouser.com/ds/2/324/ItemDetail_1725672-916605.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block RND 205-00025 pitch 10mm Varistor, diameter 9mm, width 3.8mm, pitch 5mm size 35x8.1mm^2 drill 1.1mm pad 2.1mm terminal block Metz Connect Type175_RT02705HBLC pitch 7.5mm size 45x11mm^2 drill 1.4mm pad 2.8mm terminal block RND 205-00071, 6 pins, pitch 2.54mm, package size 69.98x30x15.64mm, https://silvertel.com/images/datasheets/Ag5810-datasheet-IEEE802_3bt-Power-over-Ethernet-4-pair-PD.pdf DCDC-Converter Silvertel Ag5405 Ag5412 Ag5424 single output DCDC-Converter, CINCON, EC5BExx, 18-36VDC to dual output, http://www.cincon.com/upload/media/data%20sheets/Data%20Sheet%20(DC)/B%20CASE/SPEC-EC5BE-V24.pdf DCDC-Converter CINCON EC6Cxx single output DCDC-Converter, CINCON, EC6Cxx, single output, https://assets.tracopower.com/20171102100522/TEN10/documents/ten10-datasheet.pdf DCDC-Converter TRACO TMR1-xxxx Single_output DCDC SMD XP POWER ISU02 XP_POWER ITQxxxxS-H, SIP, (https://www.xppower.com/pdfs/SF_ITQ.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py MSOP, 16 Pin package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Through hole pin header THT 1x13 5.08mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole straight pin header, 2x26, 1.00mm.

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