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BackHole ST Morpho Connector 144 With STLink ST Morpho Connector 144 STLink AI accelerated MCU with optional wifi, https://dl.sipeed.com/MAIX/HDK/Sipeed-M1&M1W/Specifications AI Kendryte K210 RISC-V Texas Instruments EUS 5 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil SMD 2x-dip-switch SPST , Slide, row spacing 11.48 mm (451 mils 14-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 16-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil 28-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package.
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- 3.11199 0.0386449 vertex -9.06712.
- -0.433624 0.88645 facet normal 0.000482808 0.116004.
- Pin (https://www.ti.com/lit/ds/symlink/tpa6110a2.pdf), generated with kicad-footprint-generator Mounting Hardware.