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WLCSP-52, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic Small outline http://www.ti.com/lit/ml/mpds158c/mpds158c.pdf VSO40: plastic very small outline package; 40 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf VSSOP-8 2.3x2mm Pitch 0.5mm LFCSP, 8 Pin (http://www.ti.com/lit/ds/symlink/lp2951.pdf#page=27), generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for: MC_1,5/2-GF-3.81; number of pins: 04; pin pitch: 7.62mm; Angled || order number: 1830677 8A 160V Generic Phoenix Contact connector footprint for: MC_1,5/11-GF-5.08; number of pins: 16; pin pitch: 5.08mm; Vertical || order number: 1766327 12A 630V Generic Phoenix Contact connector footprint for: GMSTB_2,5/6-GF-7,62; number of pins: 02; pin.

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