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SM12B-ZESS-TB (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator JST SH series connector, B11P-VH-B (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: IPC-SM-782 page 80, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator Molex PicoBlade series connector, 53780-0270 (), generated with kicad-footprint-generator JST PHD horizontal JST J2100 series connector, S12B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WSON, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/CP_8_19.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 42820-62XX, With thermal vias in pads, 5 Pins per row (https://www.molex.com/pdm_docs/sd/430450221_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Maxim TDFN, 6 Pin (http://www.ti.com/lit/ds/symlink/tps61040.pdf#page=35), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: AE-6410-05A example for new mpn: 39-28-914x, 7 Pins per row (http://www.molex.com/pdm_docs/sd/530480210_sd.pdf), generated with kicad-footprint-generator Harwin Female Vertical Surface Mount (SMT), Audio Jack Connector (https://www.cuidevices.com/product/resource/sj2-359x-smt.pdf Korean Hroparts Elec PJ-320D-4A (https://datasheet.lcsc.com/lcsc/1810121716_Korean-Hroparts-Elec-PJ-320D-4A_C95562.pdf smt female jack horizontal A Series, 3 pole male XLR receptacle, grounding: separate ground contact connected to EP (http://www.aosmd.com/res/packaging_information/DFN5x6_8L_EP1_P.pdf 56-Lead Plastic Quad Flat Pack, 3x3mm Body, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, ST die ID 494, 3.3x3.38mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (perimeter) array, NSMD pad definition Appendix A BGA 256 1 FT256 FTG256 Spartan-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUK 7 Pin Double Sided Module Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, NSMD.

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