Labels Milestones

Back

Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 48-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), SMDSocket, SmallPads THT DIP DIL PDIP SMDIP 2.54mm 11.48mm 451mil 6-lead surface-mounted (SMD.

• -8.173038e-001 3.367959e-001 vertex -5.049778e-003 5.772892e+000 2.473857e+001.
• 1 pads, pad diameter 3mm.

New Pull Request

0 Open 0 Closed

Label

Show archived labels

Use alt + click/enter to exclude labels

All labels No label

Milestone

All milestones No milestones

Project

All projects No project

0 Open 0 Closed

Close

Label

Clear labels

Milestone

No milestone

Projects

Clear projects