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7 removed (Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic Dual Flat No-Lead Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row style2 pin1 right Through hole straight socket strip, 1x33, 1.00mm pitch, single row Through hole straight pin header, 1x37, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 2x34 2.54mm double row surface-mounted straight pin header, 1x31, 1.00mm pitch, double rows Through hole angled socket.

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