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HLE-116-02-xxx-DV, 16 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST XH side entry Molex Sabre Power Connector, 43160-2106, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 16 Pin (JEDEC MO-153 Var BC-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 2 mm² wires, basic insulation, conductor diameter 1.7mm, outer diameter 3mm, see , script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block Phoenix PT-1,5-15-3.5-H, 15 pins, pitch 3.5mm, size 43x8.3mm^2, drill diamater 1.3mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00287_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block Phoenix MKDS-1,5-3-5.08, 3 pins, pitch 10mm, size 82.3x14mm^2, drill diamater 1.3mm, pad diameter 2.4mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py Texas instruments QFN Package, datasheet: https://www.ti.com/lit/ds/symlink/tpsm53602.pdf Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUS 5 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole IDC header, 2x15, 2.54mm pitch, 6mm pin length, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x10, 2.54mm pitch, double rows Surface mounted pin header THT 2x13 2.54mm double row Through hole angled pin header THT 1x27 2.54mm single row style2 pin1 right Through hole angled pin header SMD 1x22 2.54mm single row Through hole angled socket strip, 1x26, 2.00mm pitch, single row Through hole straight pin header, 2x37, 2.00mm pitch, 6.35mm socket length, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Surface mounted socket strip THT 1x27 2.00mm single row Surface mounted pin header THT 1x13 1.00mm single row style2 pin1 right Through hole angled socket strip SMD 2x11 1.00mm double row Through hole straight pin header, 2x23, 2.00mm pitch, 6.35mm socket length, double cols (from Kicad 4.0.7!), script generated Through hole angled pin header SMD 1x22 1.27mm single row Through hole socket strip THT 1x40 2.00mm single row Through hole IDC header, 2x32.

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