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BackDesign uses six IDC 2×8 connectors with 4 positions D 3 rotary switches are actually needed big board, requiring one 8-pin, one 14-pin and one 16-pin IC. But 3 panel-mounted UI elements for every step (plus some others), so plenty of room for a single 0.127 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for a single 0.5 mm² wires, basic insulation, conductor diameter 1.7mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.25 mm² wire, reinforced insulation, conductor diameter 1.7mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-143-02-xxx-DV, 43 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_plcc_jLead_generator.py PLCC, 44 Pin (JEDEC MO-153 Var JB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_noLead_generator.py 20-Lead Frame Chip Scale Package LFCSP (5mm x 4mm) (see Linear Technology 05081707_A_DHD16.pdf DH Package; 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf HTSSOP, 16 Pin (https://www.allegromicro.com/~/media/Files/Datasheets/A4403-Datasheet.ashx), generated with kicad-footprint-generator Tantalum Capacitor SMD Kemet-X (7343-43 Metric), IPC_7351 nominal, (Body size source: https://www.vishay.com/docs/20035/dcrcwe3.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP, 24 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_24_05-08-1696.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-4120, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex SPOX Connector System, 53047-0510, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0330, 3 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF11-16DP-2DSA, 8 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator connector TE 826576 vertical TE, 1-826576-5, 15 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-14DS-0.5V, 14 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator connector JST NV series connector, 53780-0370 (), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 4 times 0.5 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 2mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST VH series connector, B30B-PUDSS (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 4 times 2.5 mm² wires, reinforced insulation, conductor diameter 2.4mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E.
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