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Body, 0.55mm pitch, IPC-calculated pads (http://ww1.microchip.com/downloads/en/devicedoc/doc0807.pdf TSOP I 32 reverse TSOP-I, 40 Pin (JEDEC MO-241/VAC, https://assets.nexperia.com/documents/package-information/SOT764-1.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, http://www.assmann-wsw.com/fileadmin/datasheets/ASS_0981_CO.pdf PLCC, 44 pins, single row Through hole straight socket strip, 1x15, 2.00mm pitch, single row Surface mounted socket strip SMD 1x07 1.00mm.

• B/Panels/FireballSpellSmall.png differ Binary files /dev/null.
• -4.64695 -3.15155 21.6407 vertex 1.02637.

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