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Http://cdn-reichelt.de/documents/datenblatt/B400/CC4V-T1A.pdf, 5.0x1.9mm^2 package SMD Crystal Oscillator Seiko Epson SG-8002JC https://support.epson.biz/td/api/doc_check.php?mode=dl&lang=en&Parts=SG-8002DC, 10.5x5.0mm^2 package SMD Resomator/Filter Murata DSN6, http://cdn-reichelt.de/documents/datenblatt/B400/DSN6NC51H.pdf, length*width=7.0x2.5mm^2 package, package length=7.0mm, package width=2.5mm, 3 pins IR-LED, diameter 3.0mm, 2 pins, diameter 5.0mm z-position of LED center 2.0mm, 2 pins, Rectangular size 3.9x1.9mm^2, 2 pins, pitch 3.5mm, size 35x7.6mm^2, drill diamater 1.15mm, pad diameter 2.3mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 1 mm² wire, reinforced insulation, conductor diameter 1.25mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1530, 15 Pins per row, Mounting: (http://www.molex.com/pdm_docs/sd/039281043_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for a single 0.5 mm² wire, basic insulation, conductor diameter 0.65mm.

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