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ESP32-S2-WROVER(-I) 2.4 GHz Wi-Fi and Bluetooth combo chip, external antenna, https://www.espressif.com/sites/default/files/documentation/esp32-s3-mini-1_mini-1u_datasheet_en.pdf 2.4 GHz Wi-Fi and Bluetooth module https://www.espressif.com/sites/default/files/documentation/esp32-s3-wroom-1_wroom-1u_datasheet_en.pdf 2.4 GHz Wi-Fi and Bluetooth combo chip with U.FL connector, https://www.espressif.com/sites/default/files/documentation/esp32-wroom-32d_esp32-wroom-32u_datasheet_en.pdf D52M ANT SoC Module https://www.thisisant.com/assets/resources/D00001687_D52_Module_Datasheet.v.2.3_(Garmin).pdf RF SoC Radio ANT Bluetooth BLE D52 nRF52 Garmin Canada Dynastream Nordic Low Power Long Range Transceiver Module SMD-16 (https://www.hoperf.com/data/upload/portal/20181127/5bfcbea20e9ef.pdf LoRa Low Power Long Range Transceiver Module SMD-16 (https://www.hoperf.com/data/upload/portal/20181127/5bfcbea20e9ef.pdf LoRa Low Power Long Range Transceiver Module Low Power Long Range Transceiver Module rf module lora lorawan Multiprotocol radio SoC module https://www.raytac.com/download/index.php?index_id=43 wireless 2.4 GHz Wi-Fi https://www.espressif.com/sites/default/files/documentation/esp32-s2-wroom_esp32-s2-wroom-i_datasheet_en.pdf 2.4 GHz Wi-Fi and Bluetooth module, https://www.espressif.com/sites/default/files/documentation/esp32-wroom-32e_esp32-wroom-32ue_datasheet_en.pdf NINA-B111 LGA module 42 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/05081875_0_UHE42.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, DF13-08P-1.25DSA, 8 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST PHD series connector, S11B-XASK-1N-BN (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 40 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T4055-1)), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP28: plastic thin shrink small outline package; 18 leads; body width 3 mm; (see NXP sot054_po.pdf TO-92 horizontal, leads molded, narrow, drill 0.75mm (https://www.diodes.com/assets/Package-Files/TO92S%20(Type%20B).pdf TO-92S_Wide package, drill 0.6mm (https://media.digikey.com/pdf/Data%20Sheets/Infineon%20PDFs/KT,KTY.pdf TO-92S package, 2-pin, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf VSSOP-8 2.3x2mm Pitch 0.5mm USON-20 2x4mm Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00869D.pdf#page=1 MAPBGA 14x14x1.18 PKG, 14.0x14.0mm, 289 Ball, 17x17 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, off-center ball grid, ST die ID 461, 4.63x4.15mm, 115 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115.

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