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[TQFP] thermal pad HTSSOP32: plastic thin shrink small outline package; 20 leads; body width 4.4 mm (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 5.475mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-2 Vertical RM 1.7mm PentawattF- MultiwattF-5 TO-220F-5, Vertical, RM 2.54mm, staggered type-2 TO-220-5, Vertical, RM 0.9mm, staggered type-1 TO-220-9 Vertical RM 5.45mm TO-3PB-3, Vertical, RM 5.08mm, see http://www.onsemi.com/pub/Collateral/FFPF10F150S-D.pdf TO-220F-2 Vertical RM 0.97mm Multiwatt-9 staggered type-1 TO-220F-15, Vertical, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220F-9 Vertical RM 4.58mm IPAK TO-251-3, Horizontal, RM 1.7mm, PentawattF-, MultiwattF-5, staggered type-2 TO-220F-15, Vertical, RM 2.54mm staggered type-2 TO-220-9 Horizontal RM 1.7mm MultiwattF-11 staggered type-1 TO-220-4 Vertical RM 3.81mm TO-264-5, Vertical, RM 0.9mm, staggered type-2 TO-220-5, Horizontal, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 7.62mm 300mil 1x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 20-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), body size 6.7x14.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 9x-dip-switch SPST , Slide, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 6-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 32-pin zero insertion force socket, through-hole, row spacing 10.16 mm (400 mils), SMDSocket, SmallPads 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils SMD DIP Switch SPST Slide 7.62mm 300mil Socket LongPads 4-lead though-hole mounted DIP package, row spacing 7.62.

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