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Href="https://gitea.circuitlocution.com/ /arrasta/commit/5ff3077e8252367b7eceb0b21b0803904b695d42">5ff3077e8252367b7eceb0b21b0803904b695d42 b1fcba1e78f37669542b35a3e32a5257c5c0240c f51b7b97734e404127fa5d5d263acbfd66f116e4 Add schematic, start on PCB sandwich, making some final-ish decisions about connecting to front panel Added schmancy pcb for v2 front panel than usual. At least it is safe to put the notice in a narrow space between two resistors Properly assign potentiometer pads and thermal vias; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l151cc.pdf WLCSP-64, 8x8 raster, 3.623x3.651mm package, pitch 0.4mm; see section 36.2.3 of http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-42363-SAM-D11_Datasheet.pdf WLCSP-56, 7x8 raster, 3.170x3.444mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UCBGA-81, 9x9 raster, 4.4084x3.7594mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f091vb.pdf WLCSP-64, 8x8 raster, 5x5mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf UFBGA 132 Pins, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=42, https://www.ti.com/lit/ml/mxbg018l/mxbg018l.pdf BGA 5 0.5 YZP Texas Instruments.

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