3
1
Back

Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf HSOP, 8 Pin (JEDEC MO-153 Var HC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_noLead_generator.py Quectel BG96 Cellular GSM 2G Module L-band satellite communication module.

New Pull Request