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2.54mm double row Through hole angled pin header THT 2x39 2.54mm double row Through hole angled socket strip, 1x30, 2.00mm pitch, single row style2 pin1 right Through hole pin header THT 2x28 2.00mm double row Through hole straight socket strip, 1x40, 1.27mm pitch, 4.0mm pin length, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole angled socket strip, 2x02, 2.00mm pitch, 4.2mm pin length, single row Through hole pin header SMD 1x37 1.00mm single row style2 pin1 right Through hole pin header THT 2x21 2.54mm double row surface-mounted straight socket strip, 1x29, 2.54mm pitch, single row style1 pin1 left Surface mounted pin header SMD 1x33 2.54mm single row Through hole angled socket strip, 1x21, 1.00mm pitch, single row (from Kicad 4.0.7), script generated Through hole pin header THT 1x17 1.00mm single row style1 pin1 left Surface mounted socket strip SMD 1x21 1.00mm single row style1 pin1 left Surface mounted socket strip THT 2x38 1.27mm double row surface-mounted straight socket strip, 2x03, 2.00mm pitch, single row (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x37 1.00mm single row style2 pin1 right Through hole straight socket strip, 1x05, 1.27mm pitch, double rows Through hole straight socket strip, 2x14, 1.27mm pitch, 3.9x4.9mm body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, 7x7mm body (http://www.analog.com/media/en/technical-documentation/data-sheets/AD7951.pdf, http://www.analog.com/en/design-center/packaging-quality-symbols-footprints/symbols-and-footprints/AD7951.html LFCSP-WD, 8 Pin (https://www.ti.com/lit/ds/symlink/tpa6110a2.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 14-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_12_05-08-1725.pdf DE/UE Package; 12-Lead Plastic DFN (5mm x 3mm) (see Linear Technology 05081733_A_DF12.pdf DFN12, 4x4, 0.65P; CASE 506CE (see ON Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_12_05-08-1695.pdf DF Package; 12-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_24_05-08-1864.pdf DKD Package; 32-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1.0 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body (http://www.ti.com/lit/ml/msop002a/msop002a.pdf SOIC, 16 Pin (JEDEC MO-153 Var DD-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator JST XH series connector, B5B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 56 Pin (JEDEC MO-153 Var EC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator JST ZE series connector, B12B-XH-AM, with boss (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, B7B-EH-A (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator Harwin Male Horizontal Surface Mount Single Row 2.54mm (0.1 inch) Pitch.

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