Labels Milestones
Back3.0mm Plated Hole as test Point, square 2.5mm side length, hole diameter 1.3mm, wire diameter 0.8mm Test point with 2 copper strips SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, pads 1-2 bridged with 2 copper strip, labeled with numbers SMD Solder 3-pad Jumper, 1x1.5mm rounded Pads, 0.3mm gap, open, labeled with numbers SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, pads 1-2 Bridged2Bar with 2 copper strip, labeled with numbers SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, bridged with 1 copper strip, labeled with numbers SMD Solder 3-pad Jumper, 1x1.5mm rounded Pads, 0.3mm gap, pads 1-2 bridged with 1 copper strip SMD 1x19 1.27mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole straight Samtec HPM power header series 11.94mm post length THT 1x13 1.00mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Surface mounted pin header THT 2x25 2.54mm double row Through hole pin header THT 1x08 2.00mm single row Surface mounted pin header SMD 1x21 2.54mm single row Through hole Samtec HPM power header series 3.81mm post length, 1x07, 5.08mm pitch, single row (from Kicad 4.0.7), script generated Through hole horizontal IDC header THT 1x17 2.54mm single row style1 pin1 left Surface mounted pin header THT 2x19 2.54mm double row Through hole angled socket strip, 1x04, 2.00mm pitch, double rows latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole socket strip SMD 2x33 1.00mm double row Through hole Samtec HPM power header series 11.94mm post length, 1x17, 5.08mm pitch, single row Through hole angled socket strip SMD 1x36 1.00mm single row Through hole angled pin header THT 1x22 1.27mm single row style2 pin1 right Through hole angled pin header THT 2x04 2.00mm double row Through hole angled pin header.
- Extend MK's 5-note sequencer. Compare to online.
- Ball, 4x5 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1963-1.pdf ST LFBGA-354.