synth_tools

Back

LIME2 development board https://www.olimex.com/Products/IoT/ESP8266/MOD-WIFI-ESP8266-DEV/resources/dimensions-WIFI-ESP8266-DEV.png Vibration motor, 2.3-3.2V, 14000rpm, 0.7G, https://www.vybronics.com/wp-content/uploads/datasheet-files/Vybronics-VZ30C1T8219732L-datasheet.pdf Broadcom LGA, 8 Pin (https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BME680-DS001-00.pdf#page=44), generated with kicad-footprint-generator ipc_noLead_generator.py HVQFN, 24 Pin (https://datasheet.lcsc.com/lcsc/1811051610_Shanghai-YDS-Tech-30F-51NL_C123168.pdf), generated with kicad-footprint-generator JST ZE series connector, BM17B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 14 Pin (https://www.st.com/resource/en/datasheet/l6491.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T2855-4)), generated with kicad-footprint-generator ipc_noLead_generator.py WSON, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/MCP6V66-Family-Data-Sheet-DS20006266A.pdf#page=35), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 4 times 1 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-130-02-xxx-DV-LC, 30 Pins (http://www.molex.com/pdm_docs/sd/547220804_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-140-02-xxx-DV-BE-A, 40 Pins (http://www.molex.com/pdm_docs/sd/529910308_sd.pdf), generated with kicad-footprint-generator Molex PicoBlade series connector, S2B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 50 Pin (JEDEC MO-153 Var HD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py 8-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_8_05-08-1637.pdf Texas Instrument DRT-3 1x0.8mm Pitch 0.7mm Texas Instruments, DSBGA, area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, YBG pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, NSMD pad definition Appendix A BGA 1156 1 RF1157 RF1158 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition Appendix A BGA 1924 1 FL1925 FLG1925 FL1926 FLG1926 FL1928 FLG1928 FL1930 FLG1930 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279, NSMD pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, http://www.latticesemi.com/view_document?document_id=213 WLCSP-16 2.225x2.17mm, 2.17x2.225mm, 16 Ball, 4x4 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 461, 4.63x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, NSMD pad definition Appendix A BGA 324 0.8 GateMate FPGA Maxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 3x4 Layout.

New Pull Request

Labels Milestones