Labels Milestones
BackDefinition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition Appendix A BGA 324 0.8 CS324 CSG324 BGA 324 0.8 CS325 CSG235 Spartan-7 BGA, 14x14 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=292, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=88, NSMD pad definition Appendix A Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7!), script generated Surface mounted pin header THT 2x11 1.27mm double row surface-mounted straight socket strip, 2x49, 1.27mm pitch, 4.4mm socket length, single row Through hole straight socket strip, 2x19, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 1x33, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 1x26, 1.00mm pitch, single row Through hole straight socket strip, 2x40, 2.00mm pitch, double rows Surface mounted pin header THT 1x11 1.27mm single row style2 pin1 right Through hole angled pin header, 2x11, 1.27mm pitch, 4.4mm socket length, single row (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x06, 2.00mm pitch, 6.35mm socket length, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 1x40 1.00mm single row style2 pin1 right Through hole socket strip THT 2x24 2.54mm double row Through hole straight socket strip, 2x29, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole horizontal IDC box header 2x30 2.54mm double row Through hole straight pin header, 2x34, 1.27mm pitch, double rows Through hole straight socket strip, 1x34, 2.00mm pitch, single row style1 pin1 left Surface mounted pin header SMD 1x13 1.00mm single row Through hole angled pin header SMD 1x07 2.00mm single row Through hole straight pin header, 2x21, 2.54mm pitch, DIN 41651 / IEC 60603-13.
- 2.5mm centerward shift for input.
- 42-lead though-hole mounted DIP.
- (T1433-2C)), generated with kicad-footprint-generator Soldered wire.