synth_tools

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1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUS 5 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), Socket 22-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), Socket 40-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils SMD DIP DIL PDIP 2.54mm 26.669999999999998mm 1050mil SMDSocket LongPads 42-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 10.8x26.96mm 10x-dip-switch SPST , Slide, row spacing 11.48 mm (451 mils 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 8-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 10.8x4.1mm DIP Switch SPST Slide 5.08mm 200mil SMD JPin SMD 6x-dip-switch SPST KingTek_DSHP06TJ, Slide, row spacing 11.48 mm (451 mils 24-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 4x-dip-switch SPST KingTek_DSHP04TJ, Slide, row spacing 7.62 mm (300 mils 18-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 64-lead surface-mounted (SMD) DIP package, row spacing 5.08mm, pin-spacing 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Vertical RM 0.9mm staggered type-1 TO-247-2, Horizontal, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Vertical RM 1.27mm.

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