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Pin (https://www.onsemi.com/pub/Collateral/561AV.PDF), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_DFN_2x3x0_9_MC_C04-123C.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 4-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 18-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 12-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 22-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), LongPads 42-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 4x-dip-switch SPST CTS_Series194-4MSTN, Piano, row spacing 11.48 mm (451 mils 32-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 4x-dip-switch SPST , Piano, row spacing 9.53 mm (375 mils), Clearance8mm 18-lead.

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