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For Wieson part number 2366C888-007 Molex 47053-1000, Foxconn HF27040-M1, Tyco 1470947-1 or equivalent, see http://www.formfactors.org/developer%5Cspecs%5Crev1_2_public.pdf pin header SMD 2x10 2.54mm double row surface-mounted straight socket strip, 2x33, 1.27mm pitch, 4.4mm socket length, single row Through hole socket strip SMD 2x36 1.27mm double row Through hole straight socket strip, 2x11, 1.27mm pitch, 4.4mm socket length, single row style2 pin1 right Through hole IDC header, 2x30, 2.54mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole straight socket strip, 2x01, 2.00mm pitch, double rows Through hole angled socket strip, 1x18, 2.00mm pitch, 4.2mm pin length, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 1x37 2.00mm single row style1 pin1 left Surface mounted pin header SMD 1x25 1.00mm single row Through hole angled socket strip SMD 1x16 2.00mm single row Through hole angled socket strip, 2x29, 1.27mm pitch, single row (from Kicad 4.0.7), script generated Through hole straight pin header, 2x02, 1.27mm pitch, double rows latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole vertical IDC box header, 2x03, 1.00mm pitch, single row Through hole pin header THT 1x16 2.54mm single row style1 pin1 left Surface mounted pin header THT 1x37 1.00mm single row style2 pin1 right Through hole straight socket strip, 2x13, 1.00mm pitch, double rows Through hole straight pin header, 1x01, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x03, 1.00mm pitch, 2.0mm pin length, single row style1 pin1 left Surface mounted pin header THT 2x29 2.00mm double row Through hole pin header SMD 1x28 1.27mm single row style1 pin1 left Surface mounted socket strip SMD 2x30 1.00mm double row surface-mounted straight socket strip, 1x24, 2.00mm pitch, single row style1 pin1 left Surface mounted socket strip THT 2x37 2.00mm double row Through hole IDC header, 2x32, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 SSO, 7 Pin Double Sided Module Texas Instruments EUW 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of 8-Lead Plastic DFN (5mm x 5mm) (see Linear Technology 05081955_0_DHC18.pdf DHD Package; 18-Lead Plastic DFN (3mm x 3mm) (http://pdfserv.maximintegrated.com/land_patterns/90-0063.PDF 14-lead very thin plastic quad flat, 3.0x4.5mm size, 0.65mm pitch (http://www.akm.com/akm/en/file/datasheet/CQ-330J.pdf AKM CZ-381x current sensor, 6.5x8.1mm body, 0.95mm pitch (http://www.akm.com/akm/en/product/detail/0009/ Allegro MicroSystems, CB-PSS Package (http://www.allegromicro.com/en/Products/Current-Sensor-ICs/Fifty-To-Two-Hundred-Amp-Integrated-Conductor-Sensor-ICs/ACS758.aspx Allegro MicroSystems, CB-PSS Package (http://www.allegromicro.com/en/Products/Current-Sensor-ICs/Fifty-To-Two-Hundred-Amp-Integrated-Conductor-Sensor-ICs/ACS758.aspx Allegro.

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