Labels Milestones
Back1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline.
- -7.795944e-001 1.747200e+001 facet normal.
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- 0.113987 0.991539 facet normal -0.247465 -0.963798.
- 3.1 3.2 4.0 Type-C receptable, through-hole mount.