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Mils 6-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 14-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), Socket 24-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 6-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 24-lead surface-mounted (SMD) DIP package, row spacing 5.08 mm (200 mils), body size 9.78x25.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin.

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