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Http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUW 7 Pin Double Sided Module Texas Instruments DSBGA BGA Texas Instruments, BGA Microstar Junior.

Connector, 502382-1370 (http://www.molex.com/pdm_docs/sd/5023820270_sd.pdf), generated with kicad-footprint-generator.
-1.056204e+000 1.747200e+001 facet normal.
-3.5433111,12.893708 v 0.19685" d="m.
Design adds the following conditions > 1. Redistributions.
52.5x7.6mm^2 drill 1.2mm pad.

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