synth_tools

Back

Of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA, area grid, YBG pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf.

SIP-12, pitch 2.54mm, package size.
Panel socket, through-hole, row spacing 9.53 mm (375.
MSTBA_2,5/7-G; number of pins.
45Degree (cable under 45degree), 1.

New Pull Request

Labels Milestones