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Plastic SMD DIL, 4.5x4mm² PhotoDiode plastic SMD DIL, 4.5x4mm² PhotoDiode plastic SMD DIL, 4.5x4mm, area: 2.65x2.65mm, https://dammedia.osram.info/media/resource/hires/osram-dam-5488319/BPW%2034%20S_EN.pdf PhotoDiode, Clear Silicone, Osram TOPLED, 4x5.09mm, area: 2.85x2.85mm, Orientation mark at cathode, https://dammedia.osram.info/media/resource/hires/osram-dam-25688470/SFH%202201%20A01_EN.pdf PhotoDiode, plastic SMD DIL, 4.5x4mm² PhotoDiode plastic SMD DIL, 4.5x4mm, area: 2.65x2.65mm, https://dammedia.osram.info/media/resource/hires/osram-dam-5467146/SFH%202440_EN.pdf DFN, 6 Pin (https://www.jedec.org/sites/default/files/docs/MO-193D.pdf variant BA), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0810, with PCB locator, 6 Pins per row (https://www.molex.com/pdm_docs/sd/430450201_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, external M3, height 6.6, Wuerth electronics 9774070943 (https://katalog.we-online.de/em/datasheet/9774070943.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 100-Lead Plastic Thin Quad Flat, No Lead Package (MF) - 6x5 mm Body [QFN] with corner pads and thermal vias; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition Appendix A Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUS 5 Pin (https://www.jedec.org/sites/default/files/docs/Mo-178c.PDF variant BA), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.7mm, height 5.5, Wuerth electronics 9774045943 (https://katalog.we-online.de/em/datasheet/9774045943.pdf.

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