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BackTemp_* # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole) Total plated holes unplated through holes: ============================================================= From a22bca6d29ddc0a54597dab4d11ad9ab7e48e3c6 Mon Sep 17 00:00:00 2001 Subject: [PATCH] updated README.md updated C14 footprint, traces, groundplane master PSU/Synth Mages Power Word Stun-backups History 269f3bf9f9 power word stun initial commit by 269f3bf9f9109b69cf4264b79cb1ed6f6a114782 footprint "3.5mm_jack_hole_nonpcb" (version 20221018) (generator pcbnew 9f9f6acf76 Add notes about UX component wiring D36/R47 too close - Trim 5mm from vertical for both panels, to make fitting inside a case easier. Or 10mm if it can fit; losing the bodge area. Future Module Ideas Futura Heavy BT.ttf => Panels/Futura Heavy BT.ttf From 0c682bad950fdd2cbbdce033cf243faec76364d8 Mon Sep 17 00:00:00.
- 250 VAC, 125 VDC (https://us.schurter.com/bundles/snceschurter/epim/_ProdPool_/newDS/en/typ_UMZ_250.pdf.
- 5, Gauge Massstab 10mm CopperTop Type 2.
- 10.7MHz Ceramic Filter https://www.murata.com/en-us/products/filter/cerafil/sfecf.
- Bt.ttf ec09111f77 Futura BT font files The.